lfd4k5/63hs-xx/f8-pf data sheet doc. no : qw0905- rev. : b date : - 2006 01 - aug. four digit led display (0.39 inch) ligitek electronics co.,ltd. property of ligitek only lfd4k5/63hs-xx/f8-pf pb lead-free parts
16.8 0.4 90 5 note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ? 0.51typ e customer p/n lapling 2.54*13=33.02 pin no.1 c dp d f g a b ligitek electronics co.,ltd. property of ligitek only 7.0(0.276") part no.lfd4k5/63hs-xx/f8-pf package dimensions 40.18(1.582") lfd4k5/63hs-xx/f8-pf bin grading order date 10.0 (0.39") dig.1 dig.4 dig.3 l1 dig.2 l2 l3 12.8 (0.504") 1.2 1/8 page 6.5 0.3
dig.4 dig.2 dig.3 dig.1 lfd4k53hs-xx/f8-pf b l3 l2 l1 3 f c f g dp e d 1 a b dp g dp c d e 2 b a e f g c d 4 lfd4k5/63hs-xx/f8-pf part no. 9 8 7 12 11 10 14 13 e dp a g f b d c 5 a internal circuit diagram b l2 l3 l1 3 f c dp f g e d 1 dp b a g dig.4 dp c e d b a 2 dig.3 e f g d c 4 page2/8 9 7 8 12 11 10 14 13 e dp a f g dig.2 b d c a 5 dig.1 lfd4k63hs-xx/f8-pf ligitek electronics co.,ltd. property of ligitek only
anode a,l1 anode b,l2 anode c,l3 anode d anode e anode f anode g anode dp no connect common cathode dig.1 14 13 12 11 10 8 9 7 6 5 cathode a,l1 14 cathode b,l2 cathode c,l3 cathode f cathode g common anode dig.1 no connect cathode dp cathode e cathode d 13 12 11 10 8 9 7 6 5 lfd4k5/63hs-xx/f8-pf common cathode l1,l2,l3 common cathode dig.2 common cathode dig.3 common cathode dig.4 electrical connection part no. 2 3 4 pin no.1 1 3/8 page common anode dig.2 common anode dig.3 common anode dig.4 common anode l1,l2,l3 lfd4k53hs-xx/f8-pf 2 3 4 pin no.1 1 lfd4k63hs-xx/f8-pf ligitek electronics co.,ltd. property of ligitek only
v 2000 esd electrostatic discharge( * ) 4/8 page ma ma mw a unit typ. iv-m 17.02:1 ratings 75 60 30 hys -25 ~ +85 -25 ~ +85 10 i f i fp pd ir t opr tstg parameter symbol operating temperature storage temperature solder temperature 1/16 inch below seating plane for 3 seconds at 260 peak forward current per chip (duty 1/10,0.1ms pulse width) power dissipation per chip reverse current per any chip forward current per chip absolute maximum ratings at ta=25 min. vf(v) min.max. 12.8 1.72.6 (nm) 15 587 electrical common cathode common anode chip material algainp yellow emitted common cathode or anode d ( nm) part no lfd4k53hs-xx/f8-pf note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. part selection and application information(ratings at 25) lfd4k63hs-xx/f8-pf iv(mcd) ligitek electronics co.,ltd. property of ligitek only lfd4k5/63hs-xx/f8-pf part no. * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded.
5/8 page ligitek electronics co.,ltd. property of ligitek only if=20ma if=10ma if=20ma if=20ma vr=5v volt nm nm mcd vf d iv a ir iv-m symbol unit test condition forward voltage per chip luminous intensity per chip spectral line half-width dominant wavelength reverse current any chip parameter luminous intensity matching ratio test condition for each parameter lfd4k5/63hs-xx/f8-pf part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500 550 600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 hys chip page 6/8 lfd4k5/63hs-xx/f8-pf part no.
page 7/8 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c 260 c3sec max 5 /sec max 260 120 temp( c) time(sec) 150 50 100 2 /sec max 25 0 preheat 0 60 seconds max lfd4k5/63hs-xx/f8-pf part no.
8/8 page description test condition this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 reference standard mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 ligitek electronics co.,ltd. property of ligitek only this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. thermal shock test high temperature high humidity test solder resistance test solderability test test item operating life test high temperature storage test low temperature storage test reliability test: lfd4k5/63hs-xx/f8-pf part no.
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